Michael He

Challenges and Future Outlook of Advanced Storage Packaging Technology

Mr. He Hongwen, Ph.D. graduated from the School of Materials Science and Engineering, Beijing University of Technology, and a postdoctoral degree from the Department of Mechanical Engineering, Tsinghua University. He used to work at the Institute of Microelectronics of the Chinese Academy of Sciences/Huajin Semiconductor, Huawei HiSilicon, and currently works at Payton Technology (Shenzhen) Co., Ltd. as the Chief Technology Officer.
Mr. He owns more than ten years of advanced packaging technology research and development and management experience. He has participated in and presided over 02 special projects, 863 projects, post-doctoral fund projects, etc. In addition, he is also a member of the National Integrated Circuit Packaging and Testing Industry Chain Technology Innovation Strategic Alliance and a member of the Expert Advisory Committee, and a director of the Anhui Semiconductor Industry Association. He has published more than 40 academic papers in core journals at home and abroad, and applied for more than 20 patents.